Product Introduction:
CQFN (Ceramic Quad Flat Non led Package) ceramic square flat lead-less packaging is mainly used in GaAs/GaN frequency wave chip packaging due to its excellent electrical and thermal properties, small size and light weight. It has excellent RF transmission performance, typically covering DC-12GHz and DC-20GHz frequencies. CQFN packaging with special design and materials can cover DC-40GHz frequencies.
Product parameters:
Product Introduction:
CQFN (Ceramic Quad Flat Non led Package) ceramic square flat lead-less packaging is mainly used in GaAs/GaN frequency wave chip packaging due to its excellent electrical and thermal properties, small size and light weight. It has excellent RF transmission performance, typically covering DC-12GHz and DC-20GHz frequencies. CQFN packaging with special design and materials can cover DC-40GHz frequencies.
Product parameters:
|
Serial Number |
product name |
Number of outgoing terminals |
Lead out pitch |
Core cavity (length mm) |
Core cavity (width mm) |
Appearance of ceramic parts (length mm) |
Appearance of ceramic parts (width mm) |
Sealing type |
|
1 |
CQFN-N06a |
6 |
1.3 |
2.2 |
1.5 |
3 |
3 |
flat pack |
|
2 |
CQFN-N06b |
6 |
1.3 |
2.2 |
1.5 |
3 |
3 |
Gold tin |
|
3 |
CQFN-N06c |
6 |
1.8 |
2.8 |
2.0 |
3.8 |
3.8 |
flat pack |
|
4 |
CQFN-N12 |
12 |
0.5 |
1.35 |
1.35 |
3 |
3 |
Gold tin |
|
5 |
CQFN-N16 |
16 |
0.5 |
2.2 |
2.2 |
4 |
4 |
Gold tin |
|
6 |
CQFN-N16a |
16 |
0.5 |
1.2 |
1.2 |
3 |
3 |
flat pack |
|
7 |
CQFN-N20 |
20 |
0.5 |
2.0 |
2.0 |
4 |
4 |
flat pack |
|
8 |
CQFN-N24 |
24 |
0.5 |
2.0 |
2.0 |
4 |
4 |
flat pack |
|
9 |
CQFN-N28 |
28 |
0.65 |
4.7 |
4.7 |
7 |
7 |
flat pack |
|
10 |
CQFN-N48 |
48 |
0.5 |
4.8 |
4.8 |
7 |
7 |
flat pack |
|
11 |
CQFN-N56 |
56 |
0.5 |
7 |
7 |
10 |
10 |
Gold tin |
