About us

Lu'an Hong'anxin Electronic Technology Co., Ltd. is a subsidiary of Beijing Yuanliu Hongyuan Electronic Technology Co., Ltd. Lu'an Hong'anxin is committed to the research and development and production of high-temperature co fired multi-layer ceramic substrates and ceramic packaging shell products, providing customers with integrated solutions for micro and nano system integration technology, and building a global leading electronic ceramic industry base. The company has a complete and independent intellectual property rights research and development and manufacturing system from powder, ceramic tape, substrate, shell to integrated packaging, which can provide users with complete solutions from design, processing to packaging, testing and verification. The company has strong technical strength, advanced process equipment, and excellent product quality. The products are widely used in fields such as single-chip integrated circuits, optoelectronic detection and communication, microwave communication modules, RF microsystems, optoelectronic microsystems, medical electronics, and automotive electronics.

Packaging design and simulation services
Hong'anxin combines its own technological characteristics to provide customers with ceramic shell, substrate, frame packaging design and simulation services.
Chip Packaging Testing Service
At present, the packaging development line has been preliminarily built to meet the traditional micro assembly process development needs of microwave devices and modules. The basic equipment is mainly manual and semi-automatic, covering the research and production capacity of single chip integrated circuits and small multi chip components.

The company's products are widely used in aerospace, aviation, shipbuilding, weapons, and electronic information

Rail transit, new energy and other industries, serving high reliability and general applications

Corporate Culture
Developing enterprises/benefiting employees/serving society/serving the motherland