Product Introduction:
The CLCC (Ceramic Leadless Chip Carrier) ceramic leadless chip carrier packaging can be divided into two structures: cavity up and cavity down. The commonly used lead end pitches are 1.27mm and 0.5mm. CLCC is suitable for surface installation, with small parasitic parameters, small volume, light weight, good heat dissipation, and easy installation of heat sinks. Used for packaging various VLSI, ASIC, ECL and other circuits.
Product parameters:
Product Introduction:
The CLCC (Ceramic Leadless Chip Carrier) ceramic leadless chip carrier packaging can be divided into two structures: cavity up and cavity down. The commonly used lead end pitches are 1.27mm and 0.5mm. CLCC is suitable for surface installation, with small parasitic parameters, small volume, light weight, good heat dissipation, and easy installation of heat sinks. Used for packaging various VLSI, ASIC, ECL and other circuits.
Product parameters:
|
Serial Number |
product name |
Number of outgoing terminals |
Lead out pitch |
Core cavity (length mm) |
Core cavity (width mm) |
Appearance of ceramic parts (length mm) |
Appearance of ceramic parts (width mm) |
Sealing type |
|
1 |
CLCC-N6 |
6 |
/ |
1.4 |
2.54 |
2.8 |
2.54 |
/ |
|
2 |
CLCC-N6a |
6 |
/ |
2.09 |
1.92 |
3.25 |
3.3 |
/ |
|
3 |
CLCC-03 |
3 |
/ |
1.8 |
1.3 |
3.05 |
2.54 |
Gold tin |
|
4 |
CLCC-03a |
3 |
/ |
1.8 |
1.6 |
4 |
3.5 |
Adhesive seal |
|
5 |
CLCC-N4 |
4 |
/ |
2 |
2 |
4.4 |
3.4 |
flat pack |
|
6 |
CLCC-N12 |
12 |
/ |
2 |
1.7 |
5.8 |
5.5 |
Adhesive seal |
|
7 |
CLCC-16 |
16 |
/ |
8.3 |
8.3 |
12 |
12 |
Gold tin |
|
8 |
CLCC-16a |
16 |
1.27 |
3 |
3 |
5 |
5 |
flat pack |
|
9 |
CLCC-16b |
16 |
1.27 |
3 |
3 |
5 |
5 |
flat pack |
|
10 |
CLCC-16c |
16 |
1.27 |
5 |
4.6 |
7 |
7 |
flat pack |
|
11 |
CLCC-N20 |
20 |
/ |
4.4 |
4.4 |
10.2 |
10.2 |
Adhesive seal |
|
12 |
CLCC-N24 |
24 |
2.54 |
16 |
16 |
21 |
21 |
Gold tin |
