1. Scope of sealed products

At present, the packaging development line has been preliminarily built to meet the traditional micro assembly process development needs of microwave devices and modules. The basic equipment is mainly manual and semi-automatic, covering the research and production capacity of single chip integrated circuits and small multi chip components.

Sealing Line Capability

Overview of the development line

2. Sealing Line Process Flow

Sealing Line Process Capability

Capable of developing single chip circuit packaging and multi chip components

Capable of parallel sealing and solder fusion sealing of ceramic and metal tube shells